Samsung is known for bringing efficient chipsets in addition to cutting-edge technologies to its smartphones for quite some time now. The company is now mass producing its chipsets based on next-generation 10nm FinFET technology. The second generation 10nm FinFET technology is built on a 10LPP (Low Power Plus). Samsung explains this new process is more power efficient than the first generation 10nm process technology, 10LPE (Low Power Early).
With the 10LPP process technology, its chipsets will be able to achieve 10 percent higher performance and 15 percent lower power consumption as compared to the previous generation. Derived from 10LPE technology, it overtures a number of competitive advantages, according to Samsung. The new process reduces the turn-around time for new chips, i.e., the time from development to mass production. Further, it provides significantly higher initial manufacturing yield to avoid incurring manufacturing loss.
The commitment to improve its 10nm technology, Samsung has promised that it will continue to work on the evolution of 10nm process down to 8LPP which will be more power efficient.
Ryan Lee, vice president of Foundry Marketing at Samsung Electronics said: “We will be able to better serve our customers through the migration from 10LPE to 10LPP with improved performance and higher initial yield.”
Consumer devices with SoCs designed on this new process technology should be available early next year, with a wider availability expected throughout the year.
In addition, Samsung has also announced its latest manufacturing plant called “S3” which will produce 10nm products and 7nm EUV (Extreme Ultra Violet) chips as well. It’s the third fabricator in Samsung’s semiconductor business which is located in Hwaseong, Korea.