Intel officially announced its new Core H-series chips at CES 2018. The new Intel chips integrate AMD’s (Advanced Micro Devices) Radeon RX Vega graphics. The 8th generation Intel processor (Core i5 and Core i7 chips) paired with AMD’s ‘semi-custom’ Radeon GPU is built for gaming aficionados, content creators etc.
Notably, the architecture will help computer makers to design smaller and faster laptops. Dell and HP for that matter will be the first to utilise these processors and bring 2-in-1 laptops with better power efficiency. Intel says that the processors are at par with Nvidia’s discrete graphics cards for gaming laptops. With a new slim design they can now fit in devices which are 17mm slim. The company believes that it will able to beat a Nvidia 1080 Max-Q with thin-and-light device that has long battery life. AMD further mentions that the Radeon Vega Mobile GPU will contest with Nvidia’s GTX-10 series.
Intel collaborating with AMD created this new design that packs a CPU, Vega Graphics and HBM2 memory all in a ‘multi-thin’ chip package. Intel has divided the class into four Core i7 and one Core i5 model with clock speeds ranging from 3.8 GHz (Core i5) to 4.2GHz (Core i7). The 14nm+ architecture chips are combined with either Radeon RX Vega M GH (Graphics High) or Radeon Graphics RX Vega M GL (Graphics Low). The Radeon Graphics RX Vega M GH models have 100W TDP rating meanwhile the GL models have a 65W TDP.
Intel claims that compared to a three-year-old laptop using a Core i7-4720 CPU, devices (slimmed to under 17 mm) with this new processor can run up to hours on a single charge and offer 1.6x better productivity and 2.3X faster graphics. The new processor uses a package technology called Embedded Multi-Die Interconnect Bridge (EMIB) that creates an eight-lane ‘data-highway’ between the processor and the graphics chip. The architecture designed for ‘intense’ graphics workload connects both the chip with a single electronic package. Further with the eight lanes of PCI Express Gen 3 interconnection between CPU and the GPU, the HBM2 will consume up to 50 percent less power compared to GDDR5 memory chips.
The 8th generation H-series chips also feature Kaby Lake-Refresh KL-R processors which are claimed to take Nvidia’s discrete GPU, the Nvidia GTX 1060 head on. The new five processors support up to 32GB dual-channel DDR4 2400 RAM. The flagship Core i7-8809G has four hyper-threaded cores accompanied by total 8MB of L3 cache. The Core i5 model features four Hyper-Threaded cores operating at a 2.8GHz base frequency and accompanies 6MB of L3 cache. Notably, the Core i7-87606G is the only processor to support vPro. All the new Core i7 and Core i5 models integrate Intel’s HD Graphics 630 that will help to power up to three displays.
John Webb, the director of client graphics marketing at Intel, in a press briefing said (via Venture Beat), that the new Core H processors work with High Bandwidth Memory 2 (HBM2), a more power-efficient stacked memory technology that AMD pioneered and has since been turned into an industry standard. The company is targeting the latest chips and the overall solution for gamers, content creators, and virtual reality fans, Webb added.
While the new laptops are expected to bring about 10 percent to 30 percent better CPU performance compared to the current models, they will also flaunt a smaller size and several times better graphics performance. Intel says that systems accommodating this new design architecture can be expected in spring this year.